Methods and systems for depositing a layer comprising vanadium, nitrogen, and a further element

ABSTRACT

Disclosed are methods and systems for depositing layers comprising vanadium, nitrogen, and element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon. The layers are deposited onto a surface of a substrate. The deposition process may be a cyclical deposition process. Exemplary structures in which the layers may be incorporated include field effect transistors, VNAND cells, metal-insulator-metal (MIM) structures, and DRAM capacitors.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to U.S. Provisional Patent Application Ser. No. 63/015,018 filed Apr. 24, 2020 titled “METHODS AND SYSTEMS FOR DEPOSITING A LAYER COMPRISING VANADIUM, NITROGEN, AND A FURTHER ELEMENT,” the disclosure of which is hereby incorporated by reference in its entirety.

FIELD OF INVENTION

The present disclosure generally relates to the field of semiconductor processing methods and systems, and in the field integrated circuit manufacture. In particular, methods and systems suitable for depositing layers comprising vanadium, nitrogen, and a further element are disclosed.

BACKGROUND OF THE DISCLOSURE

The scaling of semiconductor devices, such as, for example, complementary metal-oxide-semiconductor (CMOS) devices, has led to significant improvements in speed and density of integrated circuits. However, conventional device scaling techniques face significant challenges for future technology nodes.

For example, one challenge has been finding a suitable conducting material for use as a gate electrode in aggressively scaled CMOS devices. Various gate materials might be used, such as, for example, a metal, such as a titanium nitride layer. However, in some cases, where higher work function values than those obtained with titanium nitride layers—e.g., in PMOS regions of a CMOS device—are desired, improved materials for gate electrodes are desired. In particular, such materials can include p-dipole shifting layers, and can be used e.g. for threshold voltage tuning.

In addition, there remains a need for new materials in other semiconductor devices such as MIM (metal-insulator-metal) structures, DRAM capacitors, and VNAND cells.

Any discussion, including discussion of problems and solutions, set forth in this section has been included in this disclosure solely for the purpose of providing a context for the present disclosure. Such discussion should not be taken as an admission that any or all of the information was known at the time the invention was made or otherwise constitutes prior art.

SUMMARY OF THE DISCLOSURE

This summary may introduce a selection of concepts in a simplified form, which may be described in further detail below. This summary is not intended to necessarily identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

Various embodiments of the present disclosure relate to methods of depositing layers comprising vanadium, nitrogen, and another element, to structures and devices formed using such methods, and to apparatus for performing the methods and/or for forming the structures and/or devices. The layers may be used in a variety of applications, including work function adjustment layers, and threshold voltage threshold adjustment layers. For example, they may be used as dipole shifting layers in p-channel metal oxide semiconductor field effect transistors (MOSFETS).

Thus, provided is a method for forming a layer on a substrate in a reactor chamber. The method comprises the application of a deposition process. The deposition process comprises providing a first precursor to the reactor chamber, the first precursor comprising vanadium. In addition, the deposition process comprises providing a second precursor to the reactor chamber, the second precursor comprising an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon. In addition, the deposition process comprises providing a reactant to the reactor chamber, the reactant comprising nitrogen. Thus a layer is formed on the substrate. The layer comprises the vanadium. In addition, the layer comprises the element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon. Also, the layer comprises the nitrogen.

In some embodiments, the first precursor, the second precursor, and the reactant are simultaneously provided to the reactor chamber.

In some embodiments, the first precursor, the second precursor, and the reactant are continuously provided to the reactor chamber.

In some embodiments, the reactant comprises ammonia and/or hydrazine.

In some embodiments, the first precursor comprises one or more of a vanadium halide, a vanadium oxyhalide, and a vanadium organometallic compound.

In some embodiments, the first precursor comprises a vanadium halide.

In some embodiments, the first precursor comprises VCl₄.

In some embodiments, the first precursor comprises a vanadium beta-diketonate.

In some embodiments, the second precursor comprises a halide.

In some embodiments, the second precursor comprises a chloride.

In some embodiments, the second precursor comprises a metalorganic compound and/or a hydride.

In some embodiments, the second precursor comprises an aluminum alkyl, and the layer comprises aluminum.

In some embodiments, the second precursor comprises trimethyl aluminum.

In some embodiments, the second precursor comprises an aluminum halide, and the layer comprises aluminum.

In some embodiments, the second precursor comprises aluminum trichloride.

In some embodiments, the second precursor comprises a niobium halide, and the layer comprises niobium.

In some embodiments, the niobium halide is selected from niobium chloride and niobium bromide.

In some embodiments, the second precursor comprises a hafnium halide or a metalorganic hafnium compound, and the layer comprises hafnium.

In some embodiments, the second precursor comprises hafnium chloride.

In some embodiments, the second precursor is selected from the list consisting of 4[(C₂H₅)(CH₃)N]Hf, [(CH₂CH₃)₂N]₄Hf, and [(CH₃)₂N]₄Hf.

In some embodiments, the second precursor comprises a molybdenum halide and/or a molybdenum oxyhalide, and the layer comprises molybdenum.

In some embodiments, the second precursor is selected from MoCl₅, MoO₂Cl₂, and MoOCl₄.

In some embodiments, the second precursor comprises a silane and/or a chlorosilane, and the layer comprises silicon.

In some embodiments, second precursor is selected from the list consisting of SiCl₄, SiH₂Cl₂, Si₂Cl₆, Si₃H₂Cl₆, Si₃Cl₈, SiH₄, Si₂H₆, Si₃H₈, and SiH₂I₂.

In some embodiments, the second precursor comprises a tantalum halide and/or a metalorganic tantalum compound, and the layer comprises tantalum.

In some embodiments, the second precursor is selected from the list consisting of TaCl₅, TaBr₅, and Ta(N(CH₃)₂)₅.

In some embodiments, the second precursor is a titanium halide, and the layer comprises titanium.

In some embodiments, the second precursor is TiCl₄.

In some embodiments, the deposition process comprises a chemical vapor deposition process.

In some embodiments, the deposition process comprises a cyclical chemical vapor deposition process.

In some embodiments, the first precursor and the second precursor are simultaneously provided to the reactor chamber in precursor pulses, and the reactant is provided to the reactor chamber in reactant pulses.

In some embodiments, the precursor pulses and the reactant pulses are separated by purge steps.

In some embodiments, the first precursor and the second precursor are continually provided to the reactor chamber, and the reactant is provided to the reactor chamber in reactant pulses.

In some embodiments, the reactant pulses are separated by purge steps.

In some embodiments, the reactant is continually provided to the reactor chamber.

In some embodiments, the first precursor is provided to the reactor chamber in first precursor pulses, and the second precursor is provided to the reactor chamber in second precursor pulses.

In some embodiments, the first precursor pulses and the second precursor pulses are separated by purge steps.

In some embodiments, the first precursor and the reactant are continually provided to the reactor chamber and the second precursor is provided to the reactor chamber in second precursor pulses.

In some embodiments, the second precursor pulses are separated by purge steps.

In some embodiments, the second precursor and the reactant are continually provided to the reactor chamber and the first precursor is provided to the reactor chamber in first precursor pulses.

In some embodiments, the first precursor pulses are separated by purge steps.

In some embodiments, the step of providing the first precursor to the reactor chamber and the step of providing the second precursor to the reactor chamber are separated by a purge step.

In some embodiments, the step of providing the second precursor to the reactor chamber and the step of providing the reactant to the reactor chamber are separated by a purge step.

In some embodiments, the step of providing the reactant to the reactor chamber and the step of providing first precursor to the reactor chamber are separated by a purge step.

In some embodiments, the deposition process comprises a thermal process.

In some embodiments, the layer has a thickness from at least 0.2 nm to at most 5 nm.

In some embodiments, the substrate is a monocrystalline silicon wafer.

In some embodiments, the step of providing the first precursor to the reactor chamber and the step of providing the second precursor to the reactor chamber are separated by a purge step.

In some embodiments, the step of providing the second precursor to the reactor chamber and the step of providing the reactant to the reactor chamber are separated by a purge step.

In some embodiments, the step of providing the reactant to the reactor chamber and the step of providing first precursor to the reactor chamber are separated by a purge step.

Further described herein is a gate-all-around pmos field effect transistor comprising a threshold voltage tuning layer. The threshold voltage tuning layer is formed according to a method for forming a layer on a substrate in a reactor chamber as described herein.

In some embodiments, the threshold voltage tuning layer is positioned between a silicon oxide layer and a high-k dielectric layer.

In some embodiments, a high-k dielectric layer is positioned between a silicon oxide layer and the threshold voltage tuning layer.

Further described herein is a MIM (metal-insulator-metal) electrode comprising a layer deposited by means of a method for forming a layer on a substrate in a reactor chamber as described herein.

Further described herein is a VNAND (Vertical NAND flash memory) contact comprising a layer deposited by means of a method for forming a layer on a substrate in a reactor chamber as described herein.

Further described is a system comprising one or more reaction chambers. The system further comprises a first precursor gas source comprising a first precursor. The first precursor comprises vanadium. The second precursor gas source comprises a second precursor. The second precursor comprises an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon. The system further comprises a reactant gas source comprising a reactant. The reactant contains nitrogen. The system further comprises a controller. The controller is configured to control gas flow into at least one of the one or more reaction chambers to form a layer overlying a surface of a substrate by means of a method for forming a layer on a substrate in a reactor chamber as described herein. The layer thus formed comprises vanadium, nitrogen, and the element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon.

Further described herein is a method for etching an etchable layer overlaying a layer comprising vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon. The method comprises a step of exposing the etchable layer to an etchant for which the etchable layer has a higher etch rate compared to the layer comprising vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon.

In some embodiments, the layer comprising vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon has been deposited by means of a method for forming a layer on a substrate in a reactor chamber as described herein.

These and other embodiments will become readily apparent to those skilled in the art from the following detailed description of certain embodiments having reference to the attached figures. The invention is not being limited to any particular embodiments disclosed.

BRIEF DESCRIPTION OF THE DRAWING FIGURES

A more complete understanding of the embodiments of the present disclosure may be derived by referring to the detailed description and claims when considered in connection with the following illustrative figures.

FIG. 1 illustrates a method in accordance with exemplary embodiments of the disclosure.

FIGS. 2-4 illustrate exemplary structures in accordance with embodiments of the disclosure.

FIG. 5 illustrates a reactor system in accordance with additional exemplary embodiments of the disclosure.

FIG. 6 illustrates an exemplary DRAM capacitor (600).

FIG. 7 illustrates a part of a VNAND cell, namely a contact and charge trapping assembly (700).

Throughout the drawings, the following numbering is adhered to: 100—method; 102—step of providing a substrate within a reaction chamber; 104—deposition process; 200—device, structure; 202—substrate; 205—dielectric or insulating material; 208—layer formed according to a method as described herein; 210—additional conducting layer; 212—additional conducting layer; 300—structure; 302—substrate; 304—dielectric or insulating material; 306—layer containing vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon. 312—additional conducting layer; 314—source region; 316—drain region; 318—channel region; 400—structure; 402—semiconductor material; 404—dielectric material; 406—layer containing vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon; 408—conducting layer. 500—system; 502—one or more reaction chambers; 504—first precursor gas source; 505—second precursor gas source; 506—reactant gas source; 508—purge gas source; 510—exhaust; 512—controller; 514—first precursor gas line; 515—second precursor gas line; —516—reactant gas line; 518—purge gas line; 600—DRAM capacitor; 610—top electrode; 620—dielectric layer; 630—dielectric layer; 640—bottom electrode; 650—dielectric layer; 660—dielectric layer; 670—top electrode; 680—gap filling dielectric; 700—contact & charge trapping assembly in VNAND structure; 710—metal layer; 720—liner; 730—dielectric; 740—charge trapping layer; 750—dielectric.

It will be appreciated that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help improve understanding of illustrated embodiments of the present disclosure.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

The description of exemplary embodiments of methods, structures, devices and systems provided below is merely exemplary and is intended for purposes of illustration only; the following description is not intended to limit the scope of the disclosure or the claims. Moreover, recitation of multiple embodiments having stated features is not intended to exclude other embodiments having additional features or other embodiments incorporating different combinations of the stated features. For example, various embodiments are set forth as exemplary embodiments and may be recited in the dependent claims. Unless otherwise noted, the exemplary embodiments or components thereof may be combined or may be applied separate from each other.

As set forth in more detail below, various embodiments of the disclosure provide methods for forming structures, such as gate electrode structures. Exemplary methods can be used to, for example, to form CMOS devices, or portions of such devices. This notwithstanding, and unless noted otherwise, the invention is not necessarily limited to such examples.

In this disclosure, “gas” can include material that is a gas at normal temperature and pressure (NTP), a vaporized solid and/or a vaporized liquid, and can be constituted by a single gas or a mixture of gases, depending on the context. A gas other than the process gas, i.e., a gas introduced without passing through a gas distribution assembly, other gas distribution device, or the like, can be used for, e.g., sealing the reaction space, and can include a seal gas, such as a rare gas. In some cases, the term “precursor” can refer to a compound that participates in the chemical reaction that produces another compound, and particularly to a compound that constitutes a film matrix or a main skeleton of a film; the term “reactant” can be used interchangeably with the term precursor. The term “inert gas” can refer to a gas that does not take part in a chemical reaction and/or does not become a part of a film matrix to an appreciable extent. Exemplary inert gases include helium, argon, and any combination thereof. In some cases, an inert gas can include nitrogen and/or hydrogen.

As used herein, the term “substrate” can refer to any underlying material or materials that can be used to form, or upon which, a device, a circuit, or a film can be formed. A substrate can include a bulk material, such as silicon (e.g., single-crystal silicon), other Group IV materials, such as germanium, or other semiconductor materials, such as Group II-VI or Group III-V semiconductor materials, and can include one or more layers overlying or underlying the bulk material. Further, the substrate can include various features, such as recesses, protrusions, and the like formed within or on at least a portion of a layer of the substrate. Byway of examples, a substrate can include bulk semiconductor material and an insulating or dielectric material layer overlying at least a portion of the bulk semiconductor material.

As used herein, the term “film” and/or “layer” can refer to any continuous or non-continuous structure and material, such as material deposited by the methods disclosed herein. For example, a film and/or layer can include two-dimensional materials, three-dimensional materials, nanoparticles, partial or full molecular layers or partial or full atomic layers or clusters of atoms and/or molecules. A film or layer may partially or wholly consist of a plurality of dispersed atoms on a surface of a substrate and/or embedded in a substrate/and/or embedded in a device manufactured on that substrate. A film or layer may comprise material or a layer with pinholes and/or isolated islands. A film or layer may be at least partially continuous.

As used herein, a “structure” can be or include a substrate as described herein. Structures can include one or more layers overlying the substrate, such as one or more layers formed according to a method as described herein. Device portions can be or include structures.

The term “deposition process” as used herein can refer to the introduction of precursors (and/or reactants) into a reaction chamber to deposit a layer over a substrate. “Cyclical deposition processes” are examples of “deposition processes”.

The term “cyclic deposition process” or “cyclical deposition process” can refer to the sequential introduction of precursors (and/or reactants) into a reaction chamber to deposit a layer over a substrate and includes processing techniques such as atomic layer deposition (ALD), cyclical chemical vapor deposition (cyclical CVD), and hybrid cyclical deposition processes that include an ALD component and a cyclical CVD component.

The term “atomic layer deposition” can refer to a vapor deposition process in which deposition cycles, typically a plurality of consecutive deposition cycles, are conducted in a process chamber. The term atomic layer deposition, as used herein, is also meant to include processes designated by related terms, such as chemical vapor atomic layer deposition, atomic layer epitaxy (ALE), molecular beam epitaxy (MBE), gas source MBE, organometallic MBE, and chemical beam epitaxy, when performed with alternating pulses of precursor(s)/reactive gas(es), and purge (e.g., inert carrier) gas(es).

Generally, for ALD processes, during each cycle, a precursor is introduced to a reaction chamber and is chemisorbed to a deposition surface (e.g., a substrate surface that can include a previously deposited material from a previous ALD cycle or other material) and forming about a monolayer or sub-monolayer of material that does not readily react with additional precursor (i.e., a self-limiting reaction). Thereafter, a reactant (e.g., another precursor or reaction gas) may subsequently be introduced into the process chamber for use in converting the chemisorbed precursor to the desired material on the deposition surface. The reactant can be capable of further reaction with the precursor. Purging steps can be utilized during one or more cycles, e.g., during each step of each cycle, to remove any excess precursor from the process chamber and/or remove any excess reactant and/or reaction byproducts from the reaction chamber.

As used herein, the term “purge” may refer to a procedure in which an inert or substantially inert gas is provided to a reactor chamber in between two pulses of gasses which react with each other. For example, a purge, e.g. using nitrogen gas, may be provided between a precursor pulse and a reactant pulse, thus avoiding or at least minimizing gas phase interactions between the precursor and the reactant. It shall be understood that a purge can be effected either in time or in space, or both. For example in the case of temporal purges, a purge step can be used e.g. in the temporal sequence of providing a first precursor to a reactor chamber, providing a purge gas to the reactor chamber, and providing a second precursor to the reactor chamber, wherein the substrate on which a layer is deposited does not move. For example in the case of spatial purges, a purge step can take the following form: moving a substrate from a first location to which a first precursor is continually supplied, through a purge gas curtain, to a second location to which a second precursor is continually supplied.

As used herein, a “precursor” includes a gas or a material that can become gaseous and that can be represented by a chemical formula that includes an element which may be incorporated during a deposition process as described herein.

The term “reactant” can refer to a gas or a material that can become gaseous and that can be represented by a chemical formula that includes nitrogen. In some cases, the chemical formula includes nitrogen and hydrogen. In some cases, the nitrogen reactant does not include diatomic nitrogen.

Further, in this disclosure, any two numbers of a variable can constitute a workable range of the variable, and any ranges indicated may include or exclude the endpoints. Additionally, any values of variables indicated (regardless of whether they are indicated with “about” or not) may refer to precise values or approximate values and include equivalents, and may refer to average, median, representative, majority, or the like. Further, in this disclosure, the terms “including,” “constituted by” and “having” refer independently to “typically or broadly comprising,” “comprising,” “consisting essentially of,” or “consisting of” in some embodiments.

In this disclosure, any defined meanings do not necessarily exclude ordinary and customary meanings in some embodiments.

Provided herein is a method for forming a layer on a on a substrate in a reactor chamber. The method comprises the application of a deposition process. In some embodiments, the deposition process comprises a chemical vapor deposition process. In some embodiments, the deposition process comprises a cyclical deposition process. In some embodiments, the process comprises a cyclical chemical vapor deposition process. Additionally or alternatively, the cyclical deposition process can include an atomic layer deposition process. In some embodiments, the cyclical deposition process has characteristics of both chemical vapor deposition and atomic layer processes, i.e. the cyclical deposition process may be a hybrid cyclical process. In some embodiments, the deposition process comprises a thermal process, i.e. a process that does not use plasma-activated species.

The deposition process comprises providing a first precursor to the reactor chamber, providing a second precursor to the reactor chamber, and providing a reactant to the reactor chamber. The first precursor comprises vanadium; the second precursor comprises an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon; and the reactant comprises nitrogen. Thus, a layer is formed on the substrate. The layer thus formed comprises the vanadium, the nitrogen, and the element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon. Also, the layer comprises the nitrogen. The layers formed according to the present methods are highly advantageous, e.g. for the purpose of work function tuning, stress management, and resistivity tuning.

In some embodiments, the first precursor, the second precursor, and the reactant are simultaneously provided to the reactor chamber. In particular, the first precursor, the second precursor, and the reactant may be continuously provided to the reactor chamber. Alternatively, the first precursor, the second precursor, and the reactant may be discontinuously provided to the reactor chamber.

Various variations of cyclical deposition processes are described herein. Thus, in some embodiments, the first precursor and the second precursor are simultaneously provided to the reactor chamber in precursor pulses, and the reactant is provided to the reactor chamber in reactant pulses. Optionally, the precursor pulses and the reactant pulses are separated by purge steps. In some embodiments, the first precursor and the second precursor are continually provided to the reactor chamber, and the reactant is provided to the reactor chamber in reactant pulses. Optionally, the reactant pulses are separated by purge steps. In some embodiments, the reactant is continually provided to the reactor chamber. In some embodiments, the first precursor is provided to the reactor chamber in first precursor pulses, and the second precursor is provided to the reactor chamber in second precursor pulses. Optionally, the first precursor pulses and the second precursor pulses are separated by purge steps. In some embodiments, the first precursor and the reactant are continually provided to the reactor chamber. Optionally, the second precursor is provided to the reactor chamber in second precursor pulses. Optionally, the second precursor pulses are separated by purge steps. In some embodiments, the second precursor and the reactant are continually provided to the reactor chamber and the first precursor is provided to the reactor chamber in first precursor pulses. Optionally, the first precursor pulses are separated by purge steps. In some embodiments, the step of providing the first precursor to the reactor chamber and the step of providing the second precursor to the reactor chamber are separated by a purge step. In some embodiments, the step of providing the second precursor to the reactor chamber and the step of providing the reactant to the reactor chamber are separated by a purge step. In some embodiments, the step of providing the reactant to the reactor chamber and the step of providing first precursor to the reactor chamber are separated by a purge step.

In some embodiments, the deposition process is a cyclical deposition process, and the cyclical deposition process comprises a first precursor step in which a first precursor is provided to the reaction chamber, the cyclical deposition process comprises a second precursor step in which a second precursor is provided to the reaction chamber, and the cyclical deposition process comprises a reactant step in which a reactant is provided to the deposition chamber. It shall be understood that the totality of the aforementioned steps comprises one cycle. In other words, the sequence of providing the first precursor to the reactor chamber, providing the second precursor to the reactor chamber, providing the reactant to the reactor chamber, and optionally providing one or more purge gasses to the reactor chamber during one or more purge steps may be considered to constitute a single cycle. The total number of cycles comprised in a method as described herein depends, inter alia, on the total layer thickness which is desired. In some embodiments, the method comprises from at least 1 cycle to at most 100 cycles, or from at least 2 cycles to at most 80 cycles, or from at least 3 cycles to at most 70 cycles, or from at least 4 cycles to at most 60 cycles, or from at least 5 cycles to at most 50 cycles, or from at least 10 cycles to at most 40 cycles, or from at least 20 cycles to at most 30 cycles. In some embodiments, the method comprises at most 100 cycles, or at most 90 cycles, or at most 80 cycles, or at most 70 cycles, or at most 60 cycles, or at most 50 cycles, or at most 40 cycles, or at most 30 cycles, or at most 20 cycles, or at most 10 cycles, or at most 5 cycles, or at most 4 cycles, or at most 3 cycles, or at most 2 cycles, or a single cycle.

In some embodiments, the layer thus formed has a thickness from at least 0.2 nm to at most 5 nm, or from at least 0.3 nm to at most 4 nm, or from at least 0.4 nm to at most 3 nm, or from at least 0.5 nm to at most 2 nm, or from at least 0.7 nm to at most 1.5 nm or of at least 0.9 nm to at most 1.0 nm.

In some embodiments, the layer thus formed has a thickness of at most 5.0 nm, or a thickness of at most 4.0 nm, or a thickness of at most 3.0 nm, or a thickness of at most 2.0 nm, or a thickness of at most 1.5 nm, or a thickness of at most 1.0 nm, or a thickness of at most 0.8 nm, or a thickness of at most 0.6 nm, or a thickness of at most 0.5 nm, or a thickness of at most 0.4 nm, or a thickness of at most 0.3 nm, or a thickness of at most 0.2 nm, or a thickness of at most 0.1 nm.

In some embodiments, the layer is deposited at a substrate temperature of less than 800° C., or of at least 20° C. to at most 800° C., or of at least 100° C. to at most 400° C., or of at least 20° C. to at most 300° C., or of at least 20° C. to at most 200° C. In some embodiments, the layer is deposited at a substrate temperature of at least 100° C. to at most 500° C., or of at least 150° C. to at most 450° C., or of at least 200° C. to at most 400° C., or of at least 250° C. to at most 350° C., or of at least 275° C. to at most 325° C., or of at least 250° C. to at most 450° C., or of at least 400° C. to at most 450° C., or of at least 300° C. to at most 400° C.

In some embodiments, the layer is deposited at a pressure of less than 760 Torr or of at least 0.2 Torr to at most 760 Torr, of at least 1 Torr to at most 100 Torr, or of at least 1 Torr to at most 10 Torr. In some embodiments, the layer is deposited at a pressure of at mot 10.0 Torr, or at a pressure of at most 5.0 Torr, or at a pressure of at most 3.0 Torr, or at a pressure of at most 2.0 Torr, or at a pressure of at most 1.0 Torr, or at a pressure of at most 0.1 Torr, or at a pressure of at most 10⁻² Torr, or at a pressure of at most 10⁻³ Torr, or at a pressure of at most 10-4 Torr, or at a pressure of at most 10⁻⁵ Torr.

A monocrystalline silicon wafer may be a suitable substrate. Other substrates may be suitable well, e.g. monocrystalline germanium wafers, gallium arsenide wafers, quartz, sapphire, glass, steel, aluminum, silicon-on-insulator substrates, plastics, etc.

One advantage of the present methods is that they allow forming layer comprising vanadium and nitride with highly tunable properties. Exemplary properties which may be tuned include electron work function, stress, and resistivity. The present layers may be useful, for example, as gate stack work function tuning metals in PMOSFETS. Additionally or alternatively, they may be used in MIM metal electrodes and/or in VNAND contacts.

In some embodiments, the vanadium content of the layer is from at least 1.0 atomic percent to at most 99.0 atomic percent, or from at least 3.0 atomic percent to at most 97.0 atomic percent, or from at least 5.0 atomic percent to at most 95.0 atomic percent, or from at least 10.0 atomic percent to at most 90.0 atomic percent, or from at least 20.0 atomic percent to at most 80.0 atomic percent, or from at least 30.0 atomic percent to at most 70.0 atomic percent, or from at least 40.0 atomic percent to at most 60.0 atomic percent.

In some embodiments, the nitrogen content of the layer is from at least 1.0 atomic percent to at most 99.0 atomic percent, or from at least 3.0 atomic percent to at most 97.0 atomic percent, or from at least 5.0 atomic percent to at most 95.0 atomic percent, or from at least 10.0 atomic percent to at most 90.0 atomic percent, or from at least 20.0 atomic percent to at most 80.0 atomic percent, or from at least 30.0 atomic percent to at most 70.0 atomic percent, or from at least 40.0 atomic percent to at most 60.0 atomic percent.

In some embodiments, the molybdenum content of the layer is from at least 1.0 atomic percent to at most 99.0 atomic percent, or from at least 3.0 atomic percent to at most 97.0 atomic percent, or from at least 5.0 atomic percent to at most 95.0 atomic percent, or from at least 10.0 atomic percent to at most 90.0 atomic percent, or from at least 20.0 atomic percent to at most 80.0 atomic percent, or from at least 30.0 atomic percent to at most 70.0 atomic percent, or from at least 40.0 atomic percent to at most 60.0 atomic percent.

In some embodiments, the tantalum content of the layer is from at least 1.0 atomic percent to at most 99.0 atomic percent, or from at least 3.0 atomic percent to at most 97.0 atomic percent, or from at least 5.0 atomic percent to at most 95.0 atomic percent, or from at least 10.0 atomic percent to at most 90.0 atomic percent, or from at least 20.0 atomic percent to at most 80.0 atomic percent, or from at least 30.0 atomic percent to at most 70.0 atomic percent, or from at least 40.0 atomic percent to at most 60.0 atomic percent.

In some embodiments, the niobium content of the layer is from at least 1.0 atomic percent to at most 99.0 atomic percent, or from at least 3.0 atomic percent to at most 97.0 atomic percent, or from at least 5.0 atomic percent to at most 95.0 atomic percent, or from at least 10.0 atomic percent to at most 90.0 atomic percent, or from at least 20.0 atomic percent to at most 80.0 atomic percent, or from at least 30.0 atomic percent to at most 70.0 atomic percent, or from at least 40.0 atomic percent to at most 60.0 atomic percent.

In some embodiments, the aluminum content of the layer is from at least 1.0 atomic percent to at most 99.0 atomic percent, or from at least 3.0 atomic percent to at most 97.0 atomic percent, or from at least 5.0 atomic percent to at most 95.0 atomic percent, or from at least 10.0 atomic percent to at most 90.0 atomic percent, or from at least 20.0 atomic percent to at most 80.0 atomic percent, or from at least 30.0 atomic percent to at most 70.0 atomic percent, or from at least 40.0 atomic percent to at most 60.0 atomic percent.

In some embodiments, the silicon content of the layer is from at least 1.0 atomic percent to at most 99.0 atomic percent, or from at least 3.0 atomic percent to at most 97.0 atomic percent, or from at least 5.0 atomic percent to at most 95.0 atomic percent, or from at least 10.0 atomic percent to at most 90.0 atomic percent, or from at least 20.0 atomic percent to at most 80.0 atomic percent, or from at least 30.0 atomic percent to at most 70.0 atomic percent, or from at least 40.0 atomic percent to at most 60.0 atomic percent.

In some embodiments, the layer comprises vanadium, and nitrogen, and two or more elements selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon. For example, the layer may comprise these components in any combination of the aforementioned concentrations.

In some embodiments, the layer comprises vanadium, and nitrogen, and three or more elements selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon. For example, the layer may comprise these components in any combination of the aforementioned concentrations.

In some embodiments, the layer comprises vanadium, and nitrogen, and four or more elements selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon. For example, the layer may comprise these components in any combination of the aforementioned concentrations.

In some embodiments, the layer comprises vanadium, and nitrogen, molybdenum, tantalum, niobium, aluminum, and silicon. For example, the layer may comprise these components in any combination of the aforementioned concentrations.

In some embodiments, one or more of the steps in the present cyclic methods are separated by a purge step. Accordingly, in some embodiments, the step of providing the first precursor to the reactor chamber and the step of providing the second precursor to the reactor chamber are separated by a purge step. Additionally or independently, the step of providing the second precursor to the reactor chamber and the step of providing the reactant to the reactor chamber may be separated by a purge step. Additionally or independently, the step of providing the reactant to the reactor chamber and the step of providing first precursor to the reactor chamber may be separated by a purge step. In some embodiments, the step of providing the first precursor to the reactor chamber and the step of providing the second precursor to the reactor chamber are separated by a purge step, the step of providing the second precursor to the reactor chamber and the step of providing the reactant to the reactor chamber are separated by a purge step, and the step of providing the reactant to the reactor chamber and the step of providing the first precursor to the reactor chamber are separated by a purge step. Providing purge steps between different pulses allows minimizing parasitic reactions between precursors and/or reactants.

In the following paragraphs, process conditions are given for a reactor chamber volume of 1 liter and for 300 mm wafers. The skilled person understands that these values can be readily extended to other reactor chamber volumes and wafer sizes.

In some embodiments, the precursors and/or the reactant are entrained by a carrier gas. In some embodiments, the carrier gas is provided at a flow rate of at least 0.2 to at most 2.0 slpm, or from at least 0.3 to at most 1.5 slpm, or from at least 0.4 to at most 1.0 slpm, or from at least 0.5 to at most 0.7 slpm. In some embodiments, N₂ is used as a carrier gas. In some embodiments, a noble gas is used as a carrier gas. Suitable noble gasses include He, Ne, Ar, and Xe.

In some embodiments, the duration of the purge steps is from at least 0.025 s to at most 2.0 s, or from at least 0.05 s to at most 0.8 s, or from at least 0.1 s to at most 0.4 s, or from at least 0.2 s to at most 0.3 s.

The period during which the first precursor is supplied to the reactor chamber may be called a first precursor pulse. The period during which the second precursor is supplied to the reactor chamber may be called a second precursor pulse. The period during which the reactant is supplied to the reactor chamber may be called a reactant pulse.

In some embodiments, the duration of the first precursor pulses, the second precursor pulses and/or the reactant pulses is from at least 0.25 s to at most 4.0 s, or from at least 0.5 s to at most 2.0 s, or from at least 1.0 s to at most 1.5 s.

In some embodiments, the present methods comprise from at least 10 to at most 50 deposition cycles, or from at least 2 to at most 40 deposition cycles, or from at least 3 to at most 30 deposition cycles, or from at least 4 to at most 20 deposition cycles, or from at least 5 to at most 15 deposition cycles, or from at least 7 to at most 13 deposition cycles, or from at least 9 to at most 11 deposition cycles. In some embodiments, the present methods comprise at most 50 deposition cycles, or at most 40 deposition cycles, or at most 30 deposition cycles, or at most 20 deposition cycles, or at most 15 deposition cycles, or at most 13 deposition cycles, or at most 11 deposition cycles, or at most 9 deposition cycles, or at most 7 deposition cycles, or at most 5 deposition cycles, or at most 4 deposition cycles, or at most 3 deposition cycles, or at most 2 deposition cycles, or 1 deposition cycle. The higher the number of deposition cycles, the higher the thickness of the layer, which is deposited, all other things being equal.

Exemplary reactants can be selected from one or more of ammonia (NH₃), hydrazine (N₂H₄), other nitrogen and hydrogen-containing gases (e.g., a mixture of nitrogen gas and hydrogen gas), and the like. The reactant can include or consist of nitrogen and hydrogen. In some cases, the reactant does not include diatomic nitrogen. In some embodiments, the reactant comprises ammonia and/or hydrazine. In some embodiments, the reactant comprises ammonia. In some embodiments, the reactant comprises hydrazine. In some embodiments, the reactant comprises ammonia and hydrazine.

In some embodiments, the first precursor comprises one or more of a vanadium halide, a vanadium oxyhalide, and a vanadium organometallic compound. Thus, in some embodiments, the first precursor comprises a vanadium halide. In some embodiments, the first precursor comprises a vanadium oxyhalide. In some embodiments, the first precursor comprises vanadium oxychloride. In some embodiments, the first precursor comprises a vanadium alkoxide. In some embodiments, the first precursor comprises Vanadium(V) oxytriethoxide. In some embodiments, the first precursor comprises Vanadium(V) oxytripropoxide. In some embodiments, the first precursor comprises a vanadium organometallic compound. In some embodiments, the first precursor comprises VCl₄. In some embodiments, the first precursor comprises a vanadium beta-diketonate. In some embodiments, the first precursor comprises Vanadium(III) acetylacetonate.

In some embodiments, the first precursor can include one or more of a vanadium halide, a vanadium oxyhalide, a vanadium beta-diketonate compound, a vanadium cyclopentadienyl compound, a vanadium alkoxide compound, a vanadium dialkylamido compound, or the like.

By way of particular examples, a vanadium halide can be selected from one or more of a vanadium fluoride, a vanadium chloride, a vanadium bromide, and a vanadium iodide. The vanadium halide can include only vanadium and one or more halogens—e.g., vanadium tetrachloride or the like. A vanadium oxyhalide can be selected from one or more of vanadium oxyhalides, such as one or more of a vanadium oxyfluoride, a vanadium oxychloride, a vanadium oxybromide, and a vanadium oxyiodide. The vanadium oxyhalide can include only vanadium, oxygen, and one or more halides. By way of examples, the vanadium halide and oxyhalide can be selected from the group consisting of include one or more of VCl₄, VBr₄, Vl₄, VOCl₄, VOBr₃, VOl₃ (respectively named as vanadium tetrachloride, vanadium tetrabromide, vanadium tetraiodide, vanadiumoxytrichloride, vanadiumoxytribromide, and vanadiumoxytriiodide). For example, the first precursor may comprise VCl₄.

Exemplary vanadium beta-diketonate compounds include VO(acac)₂, VO(thd)₂, V(acac)₃, V(thd)₃ (respectively named as oxobis(2,4-pentanedionato)vanadium(IV), oxobis(2,2,6,6-tetramethyl-3,5-hepanedionato)vanadium(IV), tris(2,4-pentanedionato)vanadium(IV), and tris(2,2,6,6-tetramethyl-3,5-hepanedionato)vanadium(IV)), and the like.

Exemplary vanadium cyclopentadienyl compounds include VCp₂Cl₂, VCp₂, VCp₂(CO)₄, (respectively named as bischlorobis(cyclopentdienyl)vanadium(IV), bis(cyclopentadienyl)vanadium(II), and cyclopentadienylvanadium tetracarbonyl)). Additional exemplary vanadium cyclopentadienyl compounds include variations of these compounds, where Cp is either unsubstituted or bearing one or more alkyl groups, e.g., MeCp, EtCp, iPrCp, and the like.

Exemplary vanadium alkoxide compounds include V(OMe)₄, V(OEt)₄, V(OiPr)₄, V(OtBu)₄, VO(OMe)₃, VO(OEt)₃, VO(OiPr)₃, and VO(OtBu)₃, (respectively named as tetrakis(methoxy)vanadium(IV), tetrakis(ethoxy)vanadium(IV), tetrakis(isopropoxy)vanadium(IV), tetrakis(t-butoxy)vanadium(IV), oxotris(methoxy)vanadium(IV), oxotris(ethoxy)vanadium(IV), oxotris(isopropoxy)vanadium(IV), and, oxotris(t-butoxy)vanadium(IV)). Additional vanadium alkoxide compounds include variations of these compounds, where other alkoxy ligands are used.

Exemplary vanadium dialkylamido compounds include V(NMe₂)₄, V(NEt₂)₄, and V(NEtMe)₄, (respectively named as tetrakis(dimethylamido)vanadium(IV), tetrakis(diethylamido)vanadium(IV), and tetrakis(ethylmethylamido)vanadium(IV)).

Use of vanadium halide precursors can be advantageous relative to methods that use other precursors, such as vanadium metalorganic precursors, because the vanadium halide precursors can be relatively inexpensive, can result in vanadium layers with lower concentrations of impurities, such as carbon, and/or processes that use such precursors can be more controllable-compared to processes that use metalorganic or other vanadium precursors. Further, such reactants can be used without the assistance of a plasma to form excited species. In addition, processes that use vanadium halide may be easier to scale up, compared to methods that use organometallic vanadium precursors. In some embodiments, the use of halide-free precursors can be advantageous, e.g. when it is desirable to minimize or avoid etching of exposed dielectric layers, e.g. high-k dielectric layers.

In some embodiments, the second precursor comprises a halide. In some embodiments, the first precursor comprises a halide and the second precursor comprises a halide. In some embodiments, the first precursor is a halide and the second precursor is a halide. In some embodiments, the second precursor comprises a chloride. In some embodiments, the second precursor is a chloride. In some embodiments, the first precursor and the second precursor comprise a halide. In some embodiments, the first precursor and the second precursor comprise a chloride.

In some embodiments, the second precursor comprises a metalorganic compound. In some embodiments, the second precursor comprises a hydride. In some embodiments, the second precursor comprises an alkoxide. In some embodiments, the second precursor comprises a methoxide.

In some embodiments, the second precursor comprises an aluminum halide, and the layer comprises aluminum. In some embodiments, the second precursor comprises aluminum trichloride.

In some embodiments, the second precursor comprises an aluminum alkyl, and the layer which is deposited comprises aluminum. In some embodiments, the second precursor comprises trimethyl aluminum. In some embodiments, the second precursor comprises triethyl aluminum. In some embodiments, the second precursor comprises Tripropylaluminum. In some embodiments, the second precursor comprises triisobutylaluminum. In some embodiments, the second precursor comprises trioctylaluminum. In some embodiments, the second precursor comprises triphenylaluminum.

In some embodiments, the second precursor comprises a niobium precursor and the layer comprises niobium. In some embodiments, the niobium precursor comprises a niobium halide. In some embodiments, the niobium halide is selected from niobium chloride and niobium bromide.

In some embodiments, the second precursor comprises a niobium organometallic compound, and the layer comprises niobium. In some embodiments, the niobium organometallic compound is a niobium alkoxide. In some embodiments, the niobium alkoxide is Niobium(V) ethoxide. In some embodiments, the niobium alkoxide is niobium isopropoxide. In some embodiments, the niobium alkoxide is niobium isobutoxide.

In some embodiments, the second precursor comprises a hafnium precursor. In some embodiments, the hafnium precursor comprises a hafnium halide or a metalorganic hafnium compound, and the layer comprises hafnium. In some embodiments, the second precursor comprises a hafnium halide. In some embodiments, the hafnium halide comprises hafnium tetrachloride. In some embodiments, the hafnium precursor comprises hafnium tetrabromide. In some embodiments, the hafnium precursor comprises a metalorganic hafnium compound. In some embodiments, the metalorganic hafnium compound is a hafnium alkylamide. In some embodiments, the hafnium compound is selected from the list consisting of [(C₂H₅)(CH₃)N]₄Hf, [(CH₂CH₃)₂N]₄Hf, and [(CH₃)₂N]₄Hf. In some embodiments, the hafnium compound is [(C₂H₅)(CH₃)N]₄Hf. In some embodiments, the hafnium compound is [(CH₂CH₃)₂N]₄Hf. In some embodiments, the hafnium compound is [(CH₃)₂N]₄Hf. Preferably, the hafnium precursor is used together with NH₃ as a reactant.

In some embodiments, the second precursor comprises a molybdenum precursor and the layer comprises molybdenum. In some embodiments, the molybdenum precursor comprises a molybdenum halide and/or a molybdenum oxyhalide. In some embodiments, the molybdenum precursor is selected from the list consisting of MoCl₅, MoO₂Cl₂, and MoOCl₄. In some embodiments, the molybdenum precursor is MoCl₅. In some embodiments, the molybdenum precursor is MoO₂Cl₂. In some embodiments, the molybdenum precursor is MoCl₅.

In some embodiments, the second precursor comprises a silicon precursor and the layer comprises silicon. In some embodiments, the silicon precursor comprises a silane and/or a chlorosilane.

In some embodiments, the silicon precursor comprises a silane. In some embodiments, the silane is selected from the list consisting of SiH₄, Si₂H₆, Si₃H₈,

In some embodiments, the silicon precursor comprises a chlorosilane. In some embodiments, the chlorosilane is selected from the list consisting of SiCl₄, SiH₂Cl₂, Si₂Cl₆, Si₃H₂Cl₆, and Si₃Cl₈.

In some embodiments, the silicon precursor comprises an iodosilane. In some embodiments, the iodosilane is SiH₃I. In some embodiments, the iodosilane is SiH₂I₂. In some embodiments, the iodosilane is SiHl₃. In some embodiments, the iodosilane is SiI₄.

In some embodiments, the second precursor is a tantalum precursor and the layer comprises tantalum. In some embodiments, the tantalum precursor comprises a tantalum halide and/or a metalorganic tantalum compound.

In some embodiments, the second precursor comprises a tantalum halide. In some embodiments, the tantalum halide comprises TaCl₅. In some embodiments, the tantalum halide comprises TaBr₅.

In some embodiments, the second precursor comprises a metalorganic tantalum compound. In some embodiments, the metalorganic tantalum compound comprises Ta(N(CH₃)₂)₅.

In some embodiments, the second precursor comprises a titanium precursor, and the layer comprises titanium. In some embodiments, the titanium precursor comprises a titanium halide. In some embodiments, the titanium halide is TiCl₄. In some embodiments, the first precursor comprises VCl₄, the second precursor comprises TiCl₄, and the layer comprises titanium, vanadium, and nitrogen. In some embodiments, the first precursor is VCl₄, the second precursor is TiCl₄, the co-reactant is NH₃, and the layer consists of VTiN. This combination of precursors may be advantageous. For example, VCl₄, TiCl₄, and NH₃ are volatile and batch-compatible.

In accordance with yet additional embodiments of the disclosure, a device or portion thereof can be formed using a method and/or a structure as described herein. The device can include a substrate, an insulating or dielectric layer, a layer containing vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon overlying the insulating or dielectric layer, and optionally an additional metal layer overlying the layer containing vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon. The device can be or form part of, for example, a MOSFET, e.g. a pMOSFET.

In some embodiments, the pMOSFET device may be a gate-all-around pmos field effect transistor. Thus, further provided is a gate-all-around pmos field effect transistor comprising a threshold voltage tuning layer. The threshold voltage tuning layer comprises vanadium, nitrogen and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon. Advantageously, the threshold voltage tuning layer is formed according to a method for forming a layer on a on a substrate in a reactor chamber as described herein.

In some embodiments, the threshold tuning layer is positioned between a silicon oxide layer and a high-k dielectric layer.

In some embodiments, a high-k dielectric layer is positioned between a silicon oxide layer and the threshold voltage tuning layer.

Further provided herein is a metal-insulator-metal (MIM) metal electrode comprising a layer comprising vanadium, nitrogen and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon. Advantageously, the layer is formed according to a method for forming a layer on a on a substrate in a reactor chamber as described herein.

Further provided herein is a vertical NAND (VNAND) contact comprising a layer comprising vanadium, nitrogen and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon. Advantageously, the layer is formed according to a method for forming a layer on a on a substrate in a reactor chamber as described herein.

Further provided herein is a Dynamic random-access memory (DRAM) cell electrode comprising a layer comprising vanadium, nitrogen and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon. Advantageously, the layer is formed according to a method for forming a layer on a on a substrate in a reactor chamber as described herein.

Further provided herein is a method for etching an etchable layer overlaying a layer comprising vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon. The method comprising the step of exposing the etchable layer to an etchant which has a higher etch rate for the etchable layer compared to the layer comprising vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon. Thus, the layer comprising vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon serves as an etch stop layer. Advantageously, the layer is formed according to a method for forming a layer on a on a substrate in a reactor chamber as described herein.

Thus, further provided herein is the use of a layer comprising vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon, as an etch stop layer.

Further provided herein is a wire partially or wholly lined with a layer comprising vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon. In some embodiments, the wire comprises copper. In some embodiments, the wire comprises tungsten. In some embodiments, the wire comprises a core that consists of, or that substantially consists of, copper and/or tungsten. Advantageously, the layer is formed according to a method for forming a layer on a on a substrate in a reactor chamber as described herein. It shall be understood that the term “wire” may refer to an interconnect or to a plurality of interconnects, as are commonly encountered in integrated circuits.

Further provided herein is a system comprising one or more reaction chambers.

The system further comprises a first precursor gas source comprising a first precursor. The first precursor comprises vanadium. The system further comprises a second precursor gas source. The second gas source comprises a second precursor. The second precursor comprises an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon. The system further comprises a reactant gas source. The reactant gas source comprises a reactant. The reactant comprises nitrogen. The system further comprises a controller. The controller is configured to control gas flow into at least one of the one or more reaction chambers to form a layer overlying a surface of a substrate. The layer comprises vanadium, nitrogen, and the element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon. In some embodiments, the layer is deposited by means of a method as described herein.

Turning now to the figures, FIG. 1 illustrates a method 100 in accordance with exemplary embodiments of the disclosure. Method 100 can be used to, for example, form a gate electrode structure suitable for NMOS, PMOS, and/or CMOS devices, such as for uses as a p-dipole shifter in a CMOS device. However, unless otherwise noted, methods are not limited to such applications.

Method 100 includes the steps of providing a substrate within a reaction chamber of a reactor (step 102) and using a deposition process, depositing a layer onto a surface of the substrate (step 104). Advantageously, the deposition process comprises a cyclical deposition process. The layer comprises vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon.

During step 102, a substrate is provided within a reaction chamber. The reaction chamber used during step 102 can be or include a reaction chamber of a chemical vapor deposition reactor system configured to perform a deposition process, e.g. a cyclical deposition process. This notwithstanding, the reactor chamber may also be a reactor chamber of an atomic layer deposition system. The reaction chamber can be a standalone reaction chamber or part of a cluster tool.

Step 102 can include heating the substrate to a desired deposition temperature within the reaction chamber. In some embodiments of the disclosure, step 102 includes heating the substrate to a temperature of less than 800° C. For example, in some embodiments of the disclosure, heating the substrate to a deposition temperature may comprise heating the substrate to a temperature between approximately 20° C. and approximately 800° C., about 100° C. and about 500° C., about 150° C. and about 450° C., or about 200° C. and about 400° C.

In addition to controlling the temperature of the substrate, a pressure within the reaction chamber may also be regulated. For example, in some embodiments of the disclosure, the pressure within the reaction chamber during step 102 may be less than 760 Torr or between 0.2 Torr and 760 Torr, about 1 Torr and 100 Torr, or about 1 Torr and 10 Torr, or less than 3 Torr, or less than 2 Torr, or less than 1 Torr.

During step 104, a layer is deposited onto a surface of the substrate using a deposition process. The deposition process may be a cyclical deposition process. The layer comprises vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon. As noted above, the cyclical deposition process can include cyclical CVD, ALD, or a hybrid cyclical CVD/ALD process. For example, in some embodiments, the growth rate of a particular ALD process may be low compared with a CVD process. One approach to increase the growth rate may be that of operating at a higher deposition temperature than that typically employed in an ALD process, resulting in some portion of a chemical vapor deposition process, but still taking advantage of the sequential introduction of reactants. Such a process may be referred to as cyclical CVD. In some embodiments, a cyclical CVD process may comprise the introduction of two or more reactants into the reaction chamber, wherein there may be a time period of overlap between the two or more reactants in the reaction chamber resulting in both an ALD component of the deposition and a CVD component of the deposition. This is referred to as a hybrid process. In accordance with further examples, a cyclical deposition process may comprise the continuous flow of one reactant/precursor and the periodic pulsing of a second reactant into the reaction chamber. In some embodiments, the deposition process may be a non-cyclical process, i.e. a process in which the precursors and reactants are continuously provided to the reaction chamber.

In accordance with some examples of the disclosure, the deposition process is a thermal deposition process. In these cases, the deposition process does not include use of a plasma to form activated species for use in the deposition process. For example, the deposition process may not comprise formation or use of oxygen, nitrogen, sulfur, or carbon plasma, may not comprise formation or use of excited oxygen, nitrogen, sulfur, or carbon species, and/or may not comprise formation or use of oxygen, nitrogen, sulfur, or carbon radicals.

During step 104, a vanadium precursor, a nitrogen-containing co-reactant, and a precursor for at least one element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon is used. Suitable precursors are described elsewhere herein.

In the case of thermal cyclical deposition processes, a duration of the step of providing reactant to the reaction chamber can be relatively long to allow the reactant to react with the precursor or a derivative thereof. For example, the duration can be greater than or equal to 5 seconds or greater than or equal to 10 seconds or between about 5 and 10 seconds.

As part of step 104, the reaction chamber can be purged using a vacuum and/or an inert gas to mitigate gas phase reactions between reactants and enable self-saturating surface reactions—e.g., in the case of temporal ALD. Additionally or alternatively, the substrate may be moved to separately contact a first vapor phase reactant and a second vapor phase reactant, e.g. in the case of spatial ALD. Surplus chemicals and reaction byproducts, if any, can be removed from the substrate surface or reaction chamber, such as by purging the reaction space or by moving the substrate, before the substrate is contacted with the next reactive chemical. The reaction chamber can be purged after the step of providing a precursor to the reaction chamber and/or after the step of providing a reactant to the reaction chamber.

In some embodiments of the disclosure, method 100 includes repeating a unit deposition cycle that includes (1) providing a first precursor to the reaction chamber, the first precursor comprising vanadium; (2) providing a second precursor to the reactor chamber, the second precursor comprising an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon; and (3) providing a reactant containing nitrogen to the reaction chamber, with optional purge or move steps after step (1), after step (2) and/or after step (3). The deposition cycle can be repeated one or more times, based on, for example, desired thickness of the deposited layer. For example, if the thickness of the deposited layer is less than desired for a particular application, then the step of providing a precursor to the reaction chamber and providing a reactant to the reaction chamber can be repeated one or more times. Once the layer has been deposited to a desired thickness, the substrate can be subjected to additional processes to form a device structure and/or device.

In some embodiments, a step coverage of the layer thus formed is equal to or greater than about 50%, or greater than about 80%, or greater than about 90%, or about 95%, or about 98%, or about 99% or greater, in/on structures having aspect ratios (height/width) of more than about 2, more than about 5, more than about 10, more than about 25, more than about 50, more than about 100, or between about 10 and 100 or about 5 to about 25.

FIG. 2 illustrates a structure/a portion of a device 200 in accordance with additional examples of the disclosure. Device or structure 200 includes a substrate 202, dielectric or insulating material 205, and a layer 208 which is formed according to a method as described herein. In the illustrated example, structure 200 also includes an additional conducting layer 210.

Substrate 202 can be or include any of the substrate materials described herein.

Dielectric or insulating material 205 can include one or more dielectric or insulating material layers. By way of example, dielectric or insulating material 205 can include an interface layer 204 and a high-k material 206 deposited overlying interface layer 204. In some cases, interface layer 204 may not exist or may not exist to an appreciable extent. Interface layer 204 can include an oxide, such as a silicon oxide, which can be formed on a surface of the substrate 202 using, for example, a chemical oxidation process or an oxide deposition process. High-k material 206 can be or include, for example, a metallic oxide having a dielectric constant greater than about 7. In some embodiments, the high-k material has a dielectric constant higher than the dielectric constant of silicon oxide. Exemplary high-k materials include one or more of hafnium oxide (HfO₂), tantalum oxide (Ta₂O₅), zirconium oxide (ZrO₂), titanium oxide (TiO₂), hafnium silicate (HfSiO_(x)), aluminum oxide (Al₂O₃) or lanthanum oxide (La₂O₃), or mixtures/laminates thereof.

The layer 208 containing vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon can be formed according to a method described herein. When layer 208 is formed using a cyclical deposition process, a concentration of vanadium and/or other constituents in the layer 208 can vary from a bottom of the layer 208 to a top of the layer 208 by, for example, controlling an amount of precursor and/or reactant and/or respective pulse times during one or more deposition cycles. In some cases, the layer 208 containing vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon can have a stoichiometric composition. A work function and other properties of this layer 208 can be altered by altering an amount of vanadium and/or other compounds in the layer 208 or in a deposition cycle.

The layer 208 containing vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon can include impurities, such as halides, hydrogen or the like. In some embodiments, the impurity content may be less than one atomic percent, less than 0.2 atomic percent, or less than 0.1 atomic percent, or less than 0.05 atomic percent, alone or combined.

A thickness of the layer 208 containing vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon can vary according to application. By way of examples, a thickness of this layer 208 can be less than 5 nm or about 0.2 nm to about 5 nm, or about 0.3 nm to about 3 nm, or about 0.3 nm to about 1 nm. When used, e.g., for controlling the threshold voltage in pMOSFETS, the layer 208 containing vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon may be relatively thin, which may be desirable for many applications, including work function and/or voltage threshold adjustment layers. Exemplary thicknesses are from 0.1 to 5.0 nm, 0.2 to 4.0 nm, 0.3 to 3.0 nm, 0.4 to 2.0 nm, 0.5 to 1.5 nm, 0.7 nm to 1.3 nm, or 0.9 nm to 1.1 nm. In some embodiments, the layer may have a thickness of less than 0.1 nm. It shall be understood that such layers are not necessarily continuous, and may even consist of a plurality of isolated clusters of atoms and/or a plurality of isolated atoms.

Additionally or alternatively, the layer 208 containing vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon can form a continuous film—e.g., using method 100—at a thickness of less than <5 nm, <4 nm, <3 nm, <2 nm, <1.5 nm, <1.2 nm, <1.0 nm, or <0.9 nm. The layer 208 containing vanadium, nitrogen, and another element can be relatively smooth, with relatively low grain boundary formation. In some cases, the layer 208 containing vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon may be amorphous, or may comprise amorphous regions. Additionally or alternatively, this layer 208 may comprise relatively low columnar crystal structures (as compared to TiN). RMS roughness of an exemplary layer 208 containing vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon can be <1.0 nm, <0.7 nm, <0.5 nm, <0.4 nm, <0.35 nm, or <0.3 nm, at a thickness of less than 10 nm.

A work function of a layer 208 containing vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon can be >4.6 eV, >4.7 eV, >4.8 eV, >4.9 eV, >4.95 eV, or >5.0 eV. A work function value of a device can be shifted by about 30 meV to about 400 meV, or about 30 meV to about 200 meV, or about 50 meV to about 100 meV using such a layer.

Additional conducting layer 212 can include, for example, metal, such as a refractory metal or the like.

FIG. 3 illustrates another exemplary structure 300 in accordance with examples of the disclosure. Device or structure 300 includes a substrate 302, dielectric or insulating material 304, and a layer 306 containing vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon. In the illustrated example, structure 300 also includes an additional conducting layer 312. Substrate 302, dielectric or insulating material 304, the layer 306 containing vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon, and an additional conducting layer 312 can be the same or similar to substrate 202, dielectric or insulating material 205, the layer 208 containing vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon, and conducting layer 210.

In the illustrated example, substrate 302 includes a source region 314, a drain region 316, and a channel region 318. Although illustrated as a horizontal structure, structures and devices in accordance with examples of the disclosure can include vertical and/or three-dimensional structures and devices, such as FinFET devices, and Gate-all-around MOSFETs.

FIG. 4 illustrates another structure 400 in accordance with examples of the disclosure. Structure 400 is suitable for gate all around field effect transistors (GAA FET) (also referred to as lateral nanowire FET) devices and the like.

In the illustrated example, structure 400 includes semiconductor material 402, dielectric material 404, a layer 406 containing vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon, and a conducting layer 408. Structure 400 can be formed overlying a substrate, including any substrate materials described herein.

Semiconductor material 402 can include any suitable semiconducting material. For example, semiconductor material 402 can include Group IV, Group III-V, or Group II-VI semiconductor material. By way of example, semiconductor material 402 includes silicon.

Dielectric material 404, the layer 406 containing vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon, and conducting layer 408 can be the same or similar to dielectric or insulating material 205, the layer 208 containing vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon, and conducting layer 210, described above.

FIG. 5 illustrates a system 500 in accordance with yet additional exemplary embodiments of the disclosure. System 500 can be used to perform a method as described herein and/or form a structure or device portion as described herein.

In the illustrated example, system 500 includes one or more reaction chambers 502, a precursor gas source 504, a reactant gas source 506, a purge gas source 508, an exhaust 510, and a controller 512.

Reaction chamber 502 can include any suitable reaction chamber, such as an ALD or CVD reaction chamber.

Precursor gas source 504 can include a vessel and one or more precursors as described herein-alone or mixed with one or more carrier (e.g., inert) gases. Reactant gas source 506 can include a vessel and one or more reactants as described herein-alone or mixed with one or more carrier gases. Purge gas source 508 can include one or more inert gases as described herein. Although illustrated with four gas sources 504-508, system 500 can include any suitable number of gas sources. Gas sources 504-508 can be coupled to reaction chamber 502 via lines 514-518, which can each include flow controllers, valves, heaters, and the like.

Exhaust 510 can include one or more vacuum pumps.

Controller 512 includes electronic circuitry and software to selectively operate valves, manifolds, heaters, pumps and other components included in the system 500. Such circuitry and components operate to introduce precursors, reactants, and purge gases from the respective sources 504-508. Controller 512 can control timing of gas pulse sequences, temperature of the substrate and/or reaction chamber, pressure within the reaction chamber, and various other operations to provide proper operation of the system 500. Controller 512 can include control software to electrically or pneumatically control valves to control flow of precursors, reactants and purge gases into and out of the reaction chamber 502. Controller 512 can include modules such as a software or hardware component, e.g., a FPGA or ASIC, which performs certain tasks. A module can advantageously be configured to reside on the addressable storage medium of the control system and be configured to execute one or more processes.

Other configurations of system 500 are possible, including different numbers and kinds of precursor and reactant sources and purge gas sources. Further, it will be appreciated that there are many arrangements of valves, conduits, precursor sources, and purge gas sources that may be used to accomplish the goal of selectively feeding gases into the reaction chamber 502. Further, as a schematic representation of a system, many components have been omitted for simplicity of illustration, and such components may include, for example, various valves, manifolds, purifiers, heaters, containers, vents, and/or bypasses.

During operation of reactor system 500, substrates, such as semiconductor wafers (not illustrated), are transferred from, e.g., a substrate handling system to reaction chamber 502. Once substrate(s) are transferred to reaction chamber 502, one or more gases from gas sources 504-508, such as precursors, reactants, carrier gases, and/or purge gases, are introduced into reaction chamber 502.

FIG. 6 illustrates an exemplary DRAM capacitor (600). It includes a top electrode (610,670) which comprises two parts, i.e. an inner shell and an outer shell, in the embodiment shown. This notwithstanding, the top electrode may comprise just one, or may comprise more than two parts, e.g. three or more parts. It shall be understood that the two parts of the top electrode (610,670) in the embodiment of FIG. 6 are electrically connected to each other (connection not shown), i.e. it shall be understood that during normal operation, they are kept at the same, or approximately the same, electrical potential. The top electrode (610,670) comprises a layer comprising vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon. Preferably, this layer is deposited according to the methods disclosed herein. The top electrode (610,670) may, for example, have a thickness of at least 0.5 nm to 5.0 nm, or of at least 1.0 nm to at most 4.0 nm, or of at least 2.0 nm to at most 3.0 nm, or of at least 0.5 nm to at most 2.5 nm, or of at least 0.6 nm to at most 2.0 nm, or of at least 0.7 nm to at most 1.5 nm. The DRAM capacitor (600) further comprises a bottom electrode (640). The bottom electrode (640) comprises a layer comprising vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon. In some embodiments, the composition of the bottom electrode (640) equals the composition of the top electrode (610,670). Alternatively, the composition of the bottom electrode (640) may differ from the composition of the top electrode (610,670). The bottom electrode (640) may, for example, have a thickness of at least 1.0 nm to at most 10.0 nm or of at least 3.0 nm to at most 7.0 nm, or of at least 0.5 nm to 5.0 nm, or of at least 1.0 nm to at most 4.0 nm, or of at least 2.0 nm to at most 3.0 nm, or of at least 0.5 nm to at most 2.5 nm, or of at least 0.6 nm to at most 2.0 nm, or of at least 0.7 nm to at most 1.5 nm. The bottom electrode (640) is separated from an outer shell of the top electrode (610) by one or more dielectric layers (620,630). The embodiment shown features two dielectric layers (620,630). The one or more dielectric layers (620,630) may comprise a high-k dielectric. For example, the high-k dielectric may be selected from the list comprising hafnium oxide (HfO₂), tantalum oxide (Ta₂O₅), zirconium oxide (ZrO₂), titanium oxide (TiO₂), hafnium silicate (HfSiO_(x)), aluminum oxide (Al₂O₃) or lanthanum oxide (La₂O₃), and mixtures/laminates thereof. In some embodiments, dielectric layer (620) has the same composition as dielectric layer (630). In some embodiments, dielectric layer (620) has a different composition than dielectric layer (630). The combined thickness of the two dielectric layers (620,630) may be, for example, from at least 0.5 nm to at most 10.0 nm or of at least 1.0 nm to at most 8.0 nm, or of at least 2.0 nm to at most 6.0 nm, or of at least 3.0 nm to at most 4.0 nm. An inner shell of the top electrode (670) is separated from the bottom electrode (640) by means of one or more dielectric layers (650,660). The embodiment shown features two such dielectric layers. The one or more dielectric layers (650,660) may comprise a high-k dielectric. For example, the high-k dielectric may be selected from the list comprising hafnium oxide (HfO₂), tantalum oxide (Ta₂O₅), zirconium oxide (ZrO₂), titanium oxide (TiO₂), hafnium silicate (HfSiO_(x)), aluminum oxide (Al₂O₃) or lanthanum oxide (La₂O₃), and mixtures/laminates thereof. In some embodiments, dielectric layer (650) has the same composition as dielectric layer (660). In some embodiments, dielectric layer (650) has a different composition than dielectric layer (660). The combined thickness of the dielectric layers (650,660) may be, for example, from at least 0.5 nm to at most 10.0 nm or of at least 1.0 nm to at most 8.0 nm, or of at least 2.0 nm to at most 6.0 nm, or of at least 3.0 nm to at most 4.0 nm. In some embodiments, the thickness of the one or more dielectric layers (620,630) between the outer shell of the top electrode (610) and the bottom electrode (640) equals the thickness of the one or more dielectric layers (650,660) between the inner shell of the top electrode (670) and the bottom electrode (640), e.g. within a margin of error of less than 2.0 nm, or less than 1.5 nm, or less than 1.0 nm, or less than 0.5 nm, or less than 0.4 nm, or less than 0.3 nm, or less than 0.2 nm, or less than 0.1 nm. A gap filling dielectric (680) may be centrally disposed in the DRAM capacitor (680). Exemplary gap filling dielectrics include low-k dielectrics, e.g. SiOC, SiOCN, and the like.

FIG. 7 illustrates a part of a VNAND cell, namely a contact and charge trapping assembly (700). The contact and charge trapping assembly (700) comprises a metal layer (710). The metal layer (710) may be made from a metal such as copper, tungsten, etc. As illustrated in FIG. 7, the metal layer (710) may be lined with a liner (720). The liner may improve adhesion and/or may prevent or at least minimize out diffusion of metal, e.g. copper or tungsten, from the metal layer (710). Advantageously, the liner (720) comprises a layer comprising vanadium, nitrogen, and an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon. Advantageously, this layer is deposited by means of a method as described herein. The contact and charge trapping assembly (700) comprises a charge trapping layer (740). The charge trapping layer (740) is positioned between two dielectric layers (730,750). The charge trapping layer may comprise a conductive layer such as, for example, silicon nitride. Additionally or alternatively, the charge trapping layer may comprise a layer comprising vanadium, nitrogen, and optionally an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon. Advantageously, this layer may be deposited by means of a method as described herein. One of the dielectric layers (730) is adjacent to the liner (720). This dielectric layer (730) may, for example, comprise a high-k material. For example, the high-k dielectric may be selected from the list comprising hafnium oxide (HfO₂), tantalum oxide (Ta₂O₅), zirconium oxide (ZrO₂), titanium oxide (TiO₂), hafnium silicate (HfSiO_(x)), aluminum oxide (Al₂O₃) or lanthanum oxide (La₂O₃), and mixtures/laminates thereof. In a suitable configuration in a VNAND memory architecture, the other dielectric layer (750) may serve as a tunnel layer, and may be adjacent to a, e.g. doped polysilicon, channel layer (not shown).

The example embodiments of the disclosure described above do not limit the scope of the invention, since these embodiments are merely examples of the embodiments of the invention, which is defined by the appended claims and their legal equivalents. Any equivalent embodiments are intended to be within the scope of this invention. Indeed, various modifications of the disclosure, in addition to those shown and described herein, such as alternative useful combinations of the elements described, may become apparent to those skilled in the art from the description. Such modifications and embodiments are also intended to fall within the scope of the appended claims. 

1. A method for forming a layer on a substrate in a reactor chamber, the method comprising the application of a deposition process comprising providing a first precursor to the reactor chamber, the first precursor comprising vanadium; providing a second precursor to the reactor chamber, the second precursor comprising an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon; and providing a reactant to the reactor chamber, the reactant comprising nitrogen; thus forming a layer on the substrate, the layer comprising the vanadium; the layer comprising the element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon; and the layer comprising the nitrogen.
 2. The method according to claim 1 wherein the reactant comprises ammonia and/or hydrazine.
 3. The method according to claim 1, wherein the first precursor comprises one or more of a vanadium halide, a vanadium oxyhalide, and a vanadium organometallic compound.
 4. The method according to claim 3 wherein the first precursor comprises VCl₄.
 5. The method according to claim 1, wherein the second precursor comprises a halide.
 6. The method according to claim 1, wherein the second precursor comprises an aluminum alkyl, and wherein the layer comprises aluminum.
 7. The method according to claim 6 wherein the second precursor comprises trimethyl aluminum.
 8. The method according to claim 1, wherein the second precursor comprises a niobium halide, and wherein the layer comprises niobium.
 9. The method according to claim 1, wherein the second precursor comprises a hafnium halide or a metalorganic hafnium compound, and wherein the layer comprises hafnium.
 10. The method according to claim 1, wherein the second precursor comprises a molybdenum halide and/or a molybdenum oxyhalide, and wherein the layer comprises molybdenum.
 11. The method according to claim 1, wherein the second precursor comprises a silane and/or a chlorosilane, and wherein the layer comprises silicon.
 12. The method according to claim 1, wherein the second precursor comprises a tantalum halide and/or a metalorganic tantalum compound, and wherein the layer comprises tantalum.
 13. The method according to claim 1, wherein the second precursor comprises a titanium halide, and wherein the layer comprises titanium.
 14. The method according to claim 1, wherein a thickness of the layer is from at least 0.2 nm to at most 5 nm.
 15. The method according to claim 1, wherein the first precursor, the second precursor, and the reactant are simultaneously provided to the reactor chamber.
 16. The method according to claim 1, wherein the deposition process is a cyclical deposition process.
 17. A gate-all-around pmos field effect transistor comprising a threshold voltage tuning layer, the threshold voltage tuning layer being formed according to a method according to claim
 1. 18. A MIM metal electrode comprising a layer deposited by means of the method according to claim
 1. 19. A VNAND contact comprising a layer deposited by means of the method according to claim
 1. 20. A system comprising: one or more reaction chambers; a first precursor gas source comprising a first precursor, the first precursor comprising vanadium; a second precursor gas source comprising a second precursor, the second precursor comprising an element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon; a reactant gas source comprising a reactant, the reactant containing nitrogen; a controller, wherein the controller is configured to control gas flow into at least one of the one or more reaction chambers to form a layer overlying a surface of a substrate by means of a method according to claim 1, the layer comprising vanadium, nitrogen, and the element selected from the list consisting of molybdenum, tantalum, niobium, aluminum, and silicon. 